Hello,
I'm familiar with the standard rule of thumb where the max. power dissipation per unit area of thin film resist allowed on alumina is 500W/in^2. How about for other materials like alumina nitride and fused silica. I strongly suspect this is a function of thermal conductivity of the base material. Does anybody know of approximate values of max. power dissipation per unit area of Alumina Nitride and Fused Silica and do these values scale linearly with thermal conductivity of the base substrate? Any help would be appreciated.